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High aspect ratio micro actuation mechanism

机译:高纵横比微型致动机构

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摘要

A micro actuating structure with an out-of-plane erected body is designed, fabricated and tested. Different from the traditional micro actuators, which are located on substrate surface, this new actuation mechanism is capable of producing linear motion at a point far from substrate. This unique advantage brings the possibility of driving other 3-D structures for on or out-of-wafer applications like optical alignment or precise manipulation. The unique design of the planar structure fabricated by surface micromachining is making use of elastic polyimide joints to bring a movable large silicon plate in front of an other plate to form a parallel plate capacitor. The area of the capacitive plate is 430 microns × 330 microns where the height of the structure is about 1 mm. A 2-D simplified mechanical model of the structure is build and used to estimate the mechanical behavior of the structure by using a commercial finite element analysis program
机译:设计,制造和测试具有外平面外墙的微型致动结构。与位于基板表面上的传统微致动器不同,这种新的致动机构能够在远离基板的点处产生线性运动。这种独特的优势带来了驱动其他3-D结构的可能性,用于如光学对准或精确操作等晶片上的应用。由表面微机械制造的平面结构的独特设计是利用弹性聚酰亚胺接头,将可移动的大型硅板在另一板前方形成,以形成平行板电容器。电容板的面积为430微米×330微米,其中结构的高度约为1mm。结构的2-D简化机械模型是通过使用商业有限元分析程序来估计结构的力学行为来构建。

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