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The Accurate Modeling of the Temperature Response of Semiconductor Production Wafers during Rapid Thermal Processing

机译:快速热处理过程中半导体生产晶片温度响应的精确建模

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When a production semiconductor with un-relaxed ion-implanted regions or wafer is subject to external irradiation, a portion of the incident energy is absorbed within the wafer volume, rather than at the surface. The volume absorption will alter the distribution of energy within the wafer, resulting in temperature non-uniformity. In order to access the contribution of the volume absorption and emission processes the mathematical model and Fortran code was developed. The model of one-dimensional transient problem solves the energy equation in conjunction with the radiation problem using the Crank-Nicholson scheme. Input to the model includes material properties specified in a look-up table form. The spectral ellipsometry was used to determine the optical properties of the ion-implanted layers. The model showed the difference in the surface temperature of the wafer similar to the results observed experimentally.
机译:当具有不放松的离子注入区域或晶片的生产半导体受到外部照射时,入射能量的一部分在晶片体积内被吸收,而不是在表面。体积吸收将改变晶片内能量的分布,导致温度不均匀性。为了访问体积吸收和发射过程的贡献,开发了数学模型和FORTRAN代码。一维瞬态问题的模型解决了使用曲柄 - 尼科尔森方案的辐射问题的能量方程。输入到模型包括在查找表格中指定的材料属性。光谱椭圆测定法用于确定离子植入层的光学性质。该模型显示出类似于实验观察结果的晶片表面温度的差异。

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