Thin-Film Microelectromechanical Devices on Large-Area Substrates

摘要

We present our work, which extends microelectromechanical systems to the field of thin film technology. Low temperature, large area, thin film technology allows a greater flexibility in the choice of materials, which can be used as a substrate or as a structural material. In this paper, we present results on thin film cantilever and bridge structures, where the structural material is microcrystalline silicon, amorphous silicon, silicon nitride or aluminum. These structures are fabricated on both glass and polyethylene terephthalate substrates. Three device applications will be demonstrated: (1) an air-gap thin film transistor, (2) a microrelay based on electrostatic actuation and (3) a microresonator which uses the resonance frequency of the structures.