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Fabrication of micromachined infrared thermopile detector using novel front etch process

机译:使用新颖的前蚀刻工艺制备微机械红外热电探测器

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Instead of back etch, front-undercut and a process of their combination, novel front etch process was developed to remove bulk silicon and left a thin membrane as the supporting structure in a thermopile detector. Compared with other means of bulk micromachining process, front etch process posses many merits shown in aspects of photolithography, reliability ad dehydration operation. Using the technology, an infrared thermopile detector was also fabricated.
机译:制定了新的前蚀刻工艺而不是回蚀刻,前底切和它们的组合过程,以除去块状硅,并将薄膜作为热电探测器中的支撑结构留下。与其他散装微机械加工过程相比,前蚀刻过程具有光刻,可靠性广告脱水操作方面所示的许多优点。使用该技术,还制造了红外热电疏水探测器。

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