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Modeling of Front-Etched Micromachined Thermopile IR Detector by CMOS Technology

机译:刻蚀微机热电堆红外探测器的CMOS技术建模

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CMOS-compatible thermopile detectors are widely used for IR detection. In this paper, an analytical model is developed for front-etched thermopile IR detectors using CMOS technology. By dividing the front-etched microbridge thermopile detector into cantilever thermocouple detectors with separate absorber areas, the thermal gradient in each zone of the single thermocouple IR detector (absorber and thermocouple transducer) is analyzed using 1-D method. During thermal gradient modeling, the IR absorption of dielectric layers in the thermocouple area is also considered. The thermopile IR detector performance is then calculated by adding the temperature differences of each single thermocouple IR detector. The developed analytical model has been verified by comparing simulations with experiments. The simulation results closely agree with the measured results. For optimizing the geometry of the front-etched thermopile IR detector, a quantitative study of the detector performance is conducted with respect to the absorber width, polysilicon length, polysilicon width, and etching window width. $hfill$[2010-0150]
机译:兼容CMOS的热电堆检测器广泛用于红外检测。在本文中,使用CMOS技术为前蚀刻热电堆红外探测器开发了一个分析模型。通过将前蚀刻微桥热电堆检测器划分为具有独立吸收区的悬臂热电偶检测器,使用一维方法分析单个热电偶红外检测器(吸收器和热电偶换能器)的每个区域中的热梯度。在热梯度建模期间,还考虑了热电偶区域中介电层的IR吸收。然后,通过将每个单个热电偶红外探测器的温度差相加来计算热电堆红外探测器的性能。通过将模拟与实验进行比较,已验证了开发的分析模型。仿真结果与测量结果非常吻合。为了优化正面蚀刻的热电堆红外探测器的几何形状,针对吸收器宽度,多晶硅长度,多晶硅宽度和蚀刻窗口宽度对探测器性能进行了定量研究。 $ hfill $ [2010-0150]

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