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Reactive pulsed laser deposition of InN thin films

机译:INN薄膜的反应性脉冲激光沉积

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III-V nitrides group are promising materials for technological applications such as: semiconductor lasers, light emitting diodes, optical detectors and refractory materials. In addition, transistors based on the group III nitrides should operate at higher temperatures and under more adverse conditions than similar devices on silicon, II-VI materials, or other III-V materials, due to the high band gap, the strong chemical bonds and the high chemical inertness of the nitrides. The paper reports the first results concerning the deposition of InN thin films by reactive laser ablation of indium target in nitrogen atmosphere. A XeCl excimer laser (λ = 308 nm, τ = 30 ns) was used as laser source. The laser beam was incident on the target with an angle of 45°, laser fluency was set at 5 J/cm~2. In order to achieve uniform irradiation condition and to avoid fast drilling, the target was rotated with 180 rpm. KBr, Si and sapphire substrates were positioned at 3.5 cm from the target and parallel to it. The nitrogen pressure during deposition was set at 1 * 10~(-4), 5 * 10~(-3) and 5 * 10~(-1) mbar, respectively. Scanning Electron Microscopy (SEM), Energy Dispersive Spectroscopy (EDAX), and X-ray Diffraction (XRD) analysis were carried out in order to check the composition, structure and the surface aspect of the deposited layers.
机译:III-V氮化物组是技术应用的有希望的材料,例如:半导体激光器,发光二极管,光学检测器和耐火材料。此外,基于III族氮化物的晶体管应在较高的温度下和在硅,II-VI材料或其他III-V材料上的类似装置下的更高的不利条件下操作,因为高带隙,强化学键和氮化物的高化学惰性。本文通过氮气氛中的反应激光烧蚀通过反应激光灭菌来报告关于in Inn薄膜沉积的第一个结果。使用XECL准分子激光(λ= 308nm,τ= 30ns)作为激光源。激光束入射在目标上,角度为45°,激光流畅度设定为5J / cm〜2。为了实现均匀的照射条件并避免快速钻孔,目标用180rpm旋转。 KBR,Si和Sapphire基材从距目标和平行于3.5厘米。分别设定沉积期间的氮气压力,分别设定为1×10〜(-4),5×10〜(-3)和5×10〜(-1)曼巴。进行扫描电子显微镜(SEM),能量分散光谱(EDAX)和X射线衍射(XRD)分析以检查沉积层的组成,结构和表面方面。

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