THE EDUCATION IN THE AREA OF ELECTRONIC PACKAGING TECHNOLOGY IN WARSAW UNIVERSITY OF TECHNOLOGY

摘要

Electronic packaging technology comprises many issues concerning interconnections, packages, heat dissipation from the circuit and circuit protection against environmental conditions. Dynamic development of electronic packaging technology is accompanied with increased demands of the modernised knowledge required from engineers, researches and scientists, working in this field. So that is a great necessity to bring up to date this knowledge and educate in this area as well undergraduate students as electronic engineering staffs. In this paper the problem connected with electronic packaging technology, its role in designing and fabrication modern electronic products and the method of education of undergraduate students are discussed. Special attention is paid on education process at Faculty of Electronics and Information Technology at Warsaw University of Technology.