In the paper the thermal testing method of IC is presented. This method compares the real temperature field with the standard field, suitable for the specified energy state of the system. An original method of temperature sensor placement strategy is presented too. This placement method is proposed for fault diagnosis and fault localisation in Integrated Circuits (ICs). An algorithm based on mutual dependencies of average temperatures of selected sub-areas of IC in order to locate failure is described. Simulation results of concept of the sensors placement strategy and fault localisation are presented. Statistical analyses of the yield of the testing method are shown.
展开▼
