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Interfacing requirements for MEMS components in system-on-chip methodologies

机译:在片上系统方法中的MEMS组件的接口要求

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Modern VLSI design is moving towards a System-on-Chip design paradigm, where chip design involves the integration of separate macrocells from different manufacturers. This paper explores the obstacles to adopting this same methodology for systems incorporating MEMS components. These obstacles include the technology specific nature of most MEMS devices, interference between MEMS sensors, and the limited electronics device density of mixed MEMS/Microelectronics technologies. It is conjectured that one fruitful avenue for further work is the development of MEMS interface circuits which can be incorporated into a single SoC along with other electronics macrocells, and which then connect to discrete MEMS sensor chips.
机译:现代VLSI设计正在朝向片上系统设计范式,其中芯片设计涉及从不同制造商集成单独的宏小区。本文探讨了采用掺入MEMS组件的系统的相同方法的障碍。这些障碍包括大多数MEMS器件的技术特性,MEMS传感器之间的干扰,以及混合MEMS /微电子技术的有限电子设备密度。据猜测,一个富有成效的进一步工作的级数是MEMS接口电路的开发,其可以与其他电子宏电池一起结合到单个SOC中,然后连接到离散MEMS传感器芯片。

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