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About theoretical calculation of semiconductor's surface images for closely spaced semiconductor and metal in STM

机译:关于半导体表面图像在STM中紧密间隔半导体和金属的理论计算

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The theoretical method of the direct calculation of the potential relief of the semiconductor surface for system of semiconductor - vacuum gap - metal (SVM), which is in applied voltage U, is proposed. The calculations are based on the assumption that the metal (tip) provides the point dipole in each point of the semiconductor surface in a result of its scanning in STM. Fermi level pinning in the small voltage U is specified by the redistribution of the charge on the dipole layer (really on the semiconductor surface). It is shown that the charge density on the interface is the characteristic of the SVM system in contact and is the function of the macroscopic (screening) properties of the metal and semiconductor and also of the microscopic structure of their interface. The spatial distribution of the potential barrier V(r-bar,U) and its change in an applied voltage U is calculated for example of the n-Si(100)/Vac/W structure.
机译:提出了在施加电压U的半导体真空间隙 - 金属(SVM)系统中直接计算半导体表面潜在浮雕的理论方法。计算基于假设金属(尖端)在STM中的扫描的结果中提供半导体表面的每个点中的点偶极子。小电压U中的费米水平固定由偶极层上的电荷的重新分布(真正在半导体表面上)指定。结果表明,界面上的电荷密度是接触的SVM系统的特性,并且是金属和半导体的宏观(筛选)特性以及其界面的微观结构的功能。潜在屏障V(R-BAR,U)的空间分布及其在施加电压U中的变化是计算的,例如N-Si(100)/ Vac / W结构。

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