Induction-Assisted Bonding of Elevated Temperature Curing Adhesive Systems

摘要

Performance of elevated temperature curing adhesives by induction heating and bonding is studied. Adhesives with 250 F and 350F cure temperatures were studied with woven carbon/epoxy and glass/vinyl ester substrate material. The ability of the carbon-epoxy system to heat by induction was used to compare performance of induction bonding with autoclave baselines, without the aid of susceptor material. Lap shear tests indicate no loss in performance by induction bonding, compared to autoclave baselines, in all cases studied.