CMP wastewater treatment

摘要

The 1997 SIA National Techhnology Roadmap for Semiconductors (NTRS) predicts a decrease in integrated circuit (IC) line widths to 0.18 #mu# m form the current range of 0.5 #mu# m to 0.25 #mu# m by the year 2001.~1. Chemical-mechanical polishing (CMP) is ressential for the production of multilevel sub-0.25 #mu# m architectures because the reduction of topological defects is critical for photolithograpy resolution. Because defect reduction is especially critical in the production of the new generation of ICs, the use of CMP equipment and consumables is expected to grow at a greater rate than any other integrated circuit manufacturing equipment categyory. Toal sales of CMP and CMP-related equipment are projected to double from