The aim of this work is the development of a new intelligent power modules called IPMCM (Intelligent Power MultiChip Module). This module combines the fabrication technology of multichip modules on silicon substrate with the one of power transistors. The fabricated IPMCM includes a VDMOS at the substrate level and a gate driver at the flip-chip level, besides of two temperature sensor chips for the thermal assessment of the module. A DC-DC converter, an H-Bridge circuit has been implemented by using four of these IPMCMs mounted onto an IMS substrate with some other SMD components for a motor control application.
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