首页>
外国专利>
Packaging for electronic power devices and applications using the packaging
Packaging for electronic power devices and applications using the packaging
展开▼
机译:用于电子功率设备和应用的包装
展开▼
页面导航
摘要
著录项
相似文献
摘要
A packaging for high-power devices such as Insulated Gate Bipolar Transistors includes a direct bonded copper substrate (DBC), such as beryllium oxide (BeO), soldered directly to a heat generating surface of the high-power device. The direct bonded copper substrate (DBC) is, in turn, soldered directly to a liquid cooled heatsink (HS). The packaging improves the thermal management of the heat generated by the high-power device, and is applicable for use in a switching circuit for a 3-phase electric traction motor (M). The assembly also provides for improved wirebonding design in order to use each high-power device to its fullest.
展开▼