ELECTRONIC COMPONENT FOR WIRING, METHOD FOR MANUFACTURING THE ELECTRONIC COMPONENT, ELECTRONIC DEVICE PACKAGE TO BE USED WITH THE ELECTRONIC COMPONENT PACKAGED THEREIN, AND METHOD FOR MANUFACTURING THE ELECTRONIC DEVICE PACKAGE

摘要

Additional steps of forming perpendicular wiring, horizontal wiring and the like so as to form an electronic device package structure are unified as a component.  The electronic component for wiring is composed of: a supporting board; a horizontal wiring section formed by patterning two layers of a horizontal wiring lower layer metal and a horizontal wiring upper layer metal, which are bonded onto the supporting board using a peelable adhesive; and a perpendicular wiring section connected to the horizontal wiring section.  The horizontal wiring section and the perpendicular wiring section are formed by processing a multilayer metal material wherein at least three metal layers are laminated, the horizontal wiring upper layer metal is selected from among metals having an etching rate different from that of the horizontal wiring lower layer metal, and the horizontal wiring upper layer metal is patterned using a wiring pattern formed of the horizontal wiring lower layer metal as a mask.