首页> 外文会议>North American Manufacturing Research Institution of theSociety of Manufacturing Engineers Conference >HOW STRAINS AND STRAIN RATES ARE ACCOMMODATED BY DISLOCATIONS AND TWINS DURING CHIP FORMATION BY MACHINING
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HOW STRAINS AND STRAIN RATES ARE ACCOMMODATED BY DISLOCATIONS AND TWINS DURING CHIP FORMATION BY MACHINING

机译:通过加工在芯片形成期间,脱位和双胞胎可以如何容纳菌株和应变率

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Chip formation by machining is a high-rate, severe plastic deformation process characterized by unique micromechanics associated with the accommodation of the large strains at high strain rates. This accommodation involves interplay of dislocation and twinning mechanisms, each of which is dominant in distinct deformation regimes as a function of the material crystallography. We present some fundamental experimental characterization of these strain accommodation phenomena by coupling strain and strain-rate measurements to the elucidation of the microstructure in the severely deformed chips.
机译:通过加工芯片形成是一种高速,严重的塑性变形过程,其特征在于与高应变率高的大菌株的容纳相关的独特微机械。该住宿涉及脱位和孪晶机制的相互作用,每种情况都是以实例晶晶体学的函数在不同的变形制度中占主导地位。我们通过耦合应变和应变速率测量来介绍这些应变容纳现象的一些基本实验表征,以释放严重变形芯片中的微观结构的阐明。

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