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In-situ mesa etching and immediate regrowth in a hydride vapour phase epitaxy reactor

机译:在氢化物气相外延反应器中蚀刻和立即再生的原位MESA蚀刻和立即再生

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An in-situ mesa etching cum regrowth in a Hydride Vapour Phase Epitaxy (HVPE) reactor is demonstrated.Influence of HCl and PH_3 on the etching behaviour of surfaces with SiN_x stripes along [110] and [1-bar10] directions has been studied and qualitative etching mechanisms are proposed.Our results show that the etched depth,undercut and mesa shape can be controlled independently.The cross-section of an insitu etched and regrown mesa shows no voids and good planarization,indicating the potential of this method.Results of buried heterostructure lasers fabricated by this method are presented.
机译:对氢化物气相外延(HVPE)反应器中的原位MESA蚀刻暨再生进行了研究。HCl和PH_3对沿[110]和[1-BAR10]方向进行了SIN_X条纹的表面的蚀刻行为。提出了定性蚀刻机制。我们的结果表明,可以独立地控制蚀刻深度,底切和台面形状。Insitu蚀刻和再生Mesa的横截面显示出没有空隙和良好的平坦化,表明该方法的潜力。结果提出了通过该方法制造的埋地的异质结构激光器。

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