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Implementation of Inverse Design Methodology and Volumetric Controlled Manufacturing Methods for Device Integration

机译:用于设备集成的逆设计方法的实施和体积控制制造方法

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Photolithography is use extensively in the manufacturing of semiconductor devices. Photoresists have been used in the printing-industry to make pre-coated lithographic printing-plates for more than a century. The semiconductor-industry adopted this technique for wafer fabrication in the early 1950s. By mid 1990s, semiconductor-industry was consuming more than 3000-tons of photoresist per year. Moore's law describes an important trend in the history of computer hardware - the number of transistors can be inexpensively placed on an integrated circuit is increasing exponentially and can be doubled approximately every two years. This observation was first made by Intel co-founder Gordon E. Moore in a 1965 paper. This trend has continued for more than half a century and is not expected to stop for another decade at least and perhaps much longer. The density of transistors in a chip is increasing at an exponential rate. In 1965, Moore examined that as the transistors were made smaller through advances in Photolithography, the number would increase at "a rate of roughly a factor of two per year". Today semiconductor industry is moving towards 22nm technology. Some of the new directions in research that may allow Moore's law to continue are as follows. 1) Use of materials other than Silicon. 2) Super cooled transistors using Silicon/Germanium helium super cooled process. 3) "Memristor": a forth basic passive circuit element designed by HP labs whose existence had previously only been theorized.
机译:光刻法在制造半导体器件中广泛使用。光致抗蚀剂已被用于印刷工业中,以制备预涂层的平版印刷版以上。半导体行业采用了20世纪50年代初的晶圆制造技术。到20世纪90年代中期,半导体行业每年消耗3000多吨的光致抗蚀剂。 Moore的法律描述了计算机硬件历史中的一个重要趋势 - 晶体管的数量廉价地放置在集成电路上呈指数增加,并且大约每两年加倍。在1965年纸上,英特尔联合创始人戈登E. Moore首先是由英特尔联合创始人戈尔登·摩尔制成的。这一趋势持续了半个多世纪以上,预计至少持续了一年多的十年,也许更长时间。芯片中的晶体管密度以指数速率增加。 1965年,摩尔检查了通过光刻的进步使晶体管变小,数量将增加“每年大约两个倍数”。今天半导体行业正在走向22nm技术。可能允许摩尔定律继续持续的研究中的一些新方向如下。 1)使用除硅以外的材料。 2)超冷却晶体管使用硅/锗氦超冷却过程。 3)“Memristor”:由HP实验室设计的第四基本被动电路元件,其存在以前仅被理论化。

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