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Total operational efficiency (TOE): the determination of 2 capacity and cycle time components and their relationship to productivity improvements in a semiconductor manufacturing line

机译:总操作效率(TOE):确定2个容量和循环时间分量及其与半导体制造线的生产率改进的关系

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Short cycle time manufacturing (SCM) concepts have been developed to help understand and manage the performance of a manufacturing line. SCM assumes that each tool/toolset (and hence the overall line) can be described by a performance curve thatrelates cycle time to throughput, with cycle time increasing non-linearly as throughput approaches capacity. Productivity improvements are realized by reducing the components of capacity loss, which increase the overall capacity and, thus, shift theperformance curve. To implement SCM, all major components of capacity loss must be defined, including the primary driver for cycle time: idle- no-WIP. In order to achieve this, the analysis must look beyond a strictly tool-centric focus to a system viewfocus so that the interaction between the tool, operator, work-in-progress, etc., can be included in the components of capacity loss.This paper develops and explains total operational efficiency (TOE), which is a key component of SCM. TOE describes the capacity and cycle time components of a tool/toolset in a self-consistent and hierarchical way that reflect a system level view andwhere the interaction of the tool, operator, e WIP, etc., are taken into account. Once these components and their relationship have been defined, it is then possible to more clearly articulate responsible owners and assess the possibility of improvement.The reality of most semiconductor manufacturing lines is that tool availability is rarely the largest detractor from capacity. Instead, other issues such as the amount of automation, line layout, cycle time requirements, technology mix, etc., become theprime determiners of the effective capacity. In addition, TOE enables meaningful comparisons to be made between different lines and for the better tracking of improvements over time in any given line on a component by component basis.
机译:已经开发出短循环时间制造(SCM)概念来帮助理解和管理制造行的性能。 SCM假设每个工具/工具集(并因此整体线)可以通过对吞吐量的性能曲线进行性能曲线来描述,随着吞吐量接近容量,循环时间增加非线性。通过减少容量损失的组件来实现生产率改进,从而增加了整体容量,从而实现了便捷曲线。要实现SCM,必须定义容量损耗的所有主要组件,包括循环时间的主要驱动程序:空闲 - 无WIP。为了实现这一目标,分析必须超越严格以刀具为中心的焦点到系统维度,以便工具,操作员,工作进展等之间的交互可以包含在容量损耗的组件中。本文开发并解释了总操作效率(TOE),这是SCM的关键组成部分。脚趾以自我一致和分层方式描述了工具/工具集的容量和循环时间分量,其反映了系统级别视图和工具,操作员,e WIP等的交互的位置。一旦这些组件及其关系定义了,那么就可以更清楚地清楚地表达负责任的所有者并评估改进的可能性。大多数半导体制造线的现实是工具可用性很少是来自容量最大的折断剂。相反,其他问题,如自动化量,线路布局,周期时间要求,技术组合等,成为有效容量的临时决定员。此外,脚趾可以在不同的线路之间进行有意义的比较,并在组件的组件上的任何给定线上更好地跟踪随时间的改进。

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