A Scribe Characterization Vehicle. (CV) Test Chip has been developed to enable a fast turn around mass production yield monitoring system. The test chip design is being placed within the scribe lines of product chip reticles, efficiently utilizing three-dimensional stacking of test structures. During manufacturing, wafer level testing will be executed using pdFasTest to ensure test times below 10 minutes per 300mm wafer. The measurement data will then be analyzed using pdCV to determine yield predictive data like fail rates and defect densities. Also variability data of layer specific parameters like sheet resistance and contact/via resistance will be extracted. Finally, extensive statistical analysis will be run using dataPOWER to derive correlation to product yield as well as lot equipment history.
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