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A study of cracks in riveted joints using acoustic, electron and optical microscopy

机译:使用声学,电子和光学显微镜铆接接头裂缝研究

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The scanning acoustic microscope (SAM) was used to quantitatively investigate subsurface fatigue cracks that are not visible on an outside surface. In combination with optical and electron microscopic examination of an outside surface and with fractography of fractured specimens, the formation and growth of subsurface cracks were characterized in detail. Observations were made in multi-riveted lap-joint Al alloy panel specimens fatigued in tension. Plots of subsurface crack length vs. number of cycles show slow linear crack growth. However, when the crack becomes a surface breaking crack, i.e. a through crack, the crack growth rate increases rapidly. The length of the crack on the hidden back surface of the specimen remains longer than the length of the same crack on the front surface. Variation in the maximum nominal stress changes the fatigue crack mode.
机译:扫描声学显微镜(SAM)用于定量研究在外表面上不可见的地下疲劳裂缝。结合外表面和裂缝样品的外表面和骨切割的光学和电子显微镜检查,详细表征了地下裂缝的形成和生长。在张力疲劳的多铆接圈关节Al合金面板标本中进行了观察结果。地下裂缝长度与周期数的曲线显示慢性线性裂纹生长。然而,当裂缝变为表面断裂裂缝时,即通过裂缝,裂缝的生长速率迅速增加。样品的隐藏背面上的裂缝的长度仍然长于前表面上相同裂缝的长度。最大标称应力的变化会改变疲劳裂纹模式。

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