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A STUDY OF CRACKS IN RIVETED JOINTS USING ACOUSTIC , ELECTRON AND OPTICAL MICROSCOPY

机译:用声学,电子和光学显微镜研究铆接接头的裂纹。

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The scanning acoustic microscope (SAM) was used to quantitatively investigate subsurface fatigue cracks that are not visible on an outside surface. In combination with optical and electron microscopic examination of an outside surface and with fractography of fractured specimens, the formation and growth of subsurface cracks were characterized in detail. Observations were made in multi-riveted lap-joint Al alloy panel specimens fatigued in tension. Plots of subsurface crack length vs. number of cycles show slow linear crack growth. However, when the crack becomes a surface breaking crack, i.e. a through crack, the crack growth rate increases rapidly. The length of the crack on the hidden back surface of the specimen remains longer than the length of the same crack on the front surface. Variation in the maximum nominal stress changes the fatigue crack mode.
机译:扫描声显微镜(SAM)用于定量研究在外表面不可见的次表面疲劳裂纹。结合外表面的光学和电子显微镜检查以及断裂标本的断层扫描,详细描述了地下裂纹的形成和增长。在张力疲劳的多铆接搭接铝合金面板样品中进行观察。地下裂纹长度与循环次数的关系图显示出缓慢的线性裂纹扩展。然而,当裂纹变成表面断裂裂纹,即贯通裂纹时,裂纹的生长速度迅速增加。试样的隐藏后表面上的裂纹长度要比前表面上相同裂纹的长度更长。最大公称应力的变化会改变疲劳裂纹模式。

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