Adhesion Improvement of Layer-to-Layer Conection For Build-Up Printed Circuit Boards

摘要

The circuit density of printed circuit boards has increased with a miniaturization of electric devices. The build-up method has been paid attention for this demand. The build-up printed circuit boards are new manufacturing technologies accumulating the dielectric layer and the conductive layer sequentially on the core circuit boards. The fundamental technologies such as a dielectric material selection, microvias formation and fine line imaging are required for the build-up process. the adhesion strength between the copper conductor and dielectric layer is especially important to improve a connection reliability.