Sun's Ultrasparc-IIi Processor Module Designed for High Performance

摘要

Sun Microsystems UltraSPARC-IIi processor system module is designed into a smaller and lower cost module using MCM technologies. This module contains the Flip-Chip die of the CPU, three L2 cache PBGA SRAMs (.25MB), and two SOIC clock support chips. Description of the project and design goals/results for implementing this 300MHz module includetiming verification, clock circuit design, functional simulation, power management, testing and the various design flows used in each area.