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High temperature stable W and WSi_x contacts on n-and p-GaN

机译:高温稳定W和N-and P-GaN的触点和WSI_X触点

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The thermal stability of W and WSi_x ohmic contacts on epi or ion-implanted P-and n-type GaN has been examined. In Si-implanted GaN annealed at => 1400 deg C, very high n-type doping levels have been obtaind (approx 5 x 10~(20) cm~(-3)) and good specific contact resistances are obtained for the rfractory metals (10~(-6) OMEGA -cm~2 range). However, implantation of Mg~+ only produces p-type doping levels in the low 10~(17) cn~(-3) range. On p-GaN, leaky Schottky diode behavior is observed for W, WSi_x and Ni/Au contacts at room temperature. As the hole concentration increases with measurement temperature, ohmic characteristics are obtained at 250-300 deg C, but R_c values are still typically in the 10~(-2) OMEGA -cm~2 range.
机译:已经研究了对ePI或离子注入的p-and n型GaN上的W和WSI_x欧姆接触的热稳定性。在Si植入的GaN中,在=> 1400℃下退火,已经获得了非常高的n型掺杂水平(大约5×10〜(20)cm〜(-3)),并且为rfractory金属获得了良好的特定接触电阻(10〜( - (-6)omega -cm〜2系列)。然而,Mg〜+的植入仅在低10〜(17)CN〜(-3)范围内产生p型掺杂水平。在P-GaN上,在室温下观察W,WSI_X和Ni / Au触点的泄漏肖特基二极管行为。随着空穴浓度随测量温度的增加,在250-300℃下获得欧姆特性,但R_C值通常仍然在10〜(-2)ω-cm〜2范围内。

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