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Energy and Operational Benefits of Thermoelectric Chillers in Semiconductor Manufacturing

机译:半导体制造中热电冷却器的能量和运行益处

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Semiconductor manufacturing is a high-tech industry that relies heavily on automated tools in the fabrication process. With technologies down to 0.18micron and even smaller line widths, semiconductor products are extremely sensitive to produce, and many manufacturing tools require dedicated process cooling that is typically provided in the form of a dedicated conventional vapor compressor chiller. In 2010 National Semiconductor’s Portland, Maine facility retrofitted forty-nine existing vapor compressor chillers to thermoelectric chillers. This paper details the retrofit project and the significant energy savings that were realized. National Semiconductor Maine (NSME) is a Class 1 200mm wafer fab with 80,000 square feet of manufacturing space. In an effort to reduce the considerable energy associated with wafer fabrication, NSME installed forty-nine Solid State Cooling ThermoRack 1200 W thermoelectric chillers. Thermoelectric chillers (TECs) utilize the Peltier effect in order to transfer heat through electron flow. The TECs reduce the energy associated with process cooling and significantly reduce the amount of heat rejected into the fabrication space, thereby reducing the load on the space cooling systems. On average, direct energy use was reduced by 1.873 kW per retrofitted chiller with total (direct and indirect) annual electric savings of 827,976 kWh. The project was partially funded through Efficiency Maine’s custom incentive program, which provides cash incentives for projects that demonstrate electrical energy savings meeting prescribed simple payback and benefit-cost ratios. Due to the success of the project in terms of energy savings and process stability, National plans to install an additional fifty thermoelectric chillers in 2011. A review of the literature on solid state or thermoelectric cooling reveals little in the way of case studies or commercialized products and focuses instead on the theoretical and experimental aspects of the technology. This paper will report on the details of the installed system, and pre- and post-metering results.
机译:半导体制造是一种高科技产业,严重依赖于制造过程中的自动化工具。通过技术低至0.18微米且甚至更小的线宽,半导体产品对生产非常敏感,并且许多制造工具需要专用的工艺冷却,其通常以专用的传统蒸汽压缩机冷却器的形式提供。 2010年国家半导体的波特兰,缅因州设施将四十九个现有的蒸汽压缩机冷却器改装为热电冷却器。本文详细说明了改造项目和实现的显着节省。 National Semiconductor Maine(NSME)是一个1级200mm晶圆厂,拥有80,000平方英尺的制造空间。努力减少与晶片制造相关的相当大的能量,NSME安装了四十九个固态冷却热带1200W热电冷却器。热电冷却器(TECS)利用珀耳帖效果来通过电子流传递热量。 TECS减少了与过程冷却相关的能量,并显着减少排入制造空间的热量,从而减少了空间冷却系统上的负荷。平均而言,直接能源使用减少1.873千瓦,每次改装冷却器总数(直接和间接)年度电能节省827,976千瓦时。该项目部分通过效率缅因州的自定义激励计划部分资助,该计划为展示了展示了规定简单的投资回报和福利成本比率的电能节约的项目的现金激励。由于该项目在节能和过程稳定方面的成功,2011年的国家计划在2011年安装额外的五十热电冷却器。关于固态或热电冷却的文献综述呈案例研究或商业化产品略微揭示并侧重于技术的理论和实验方面。本文将报告已安装系统的详细信息,并进行了预计量结果。

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