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PROCESS INTEGRATION EVOLUTION IN MANUFACTURING TECHNOLOGIES FOR FLASH MEMORIES

机译:闪存制造技术的过程集成演变

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At the end of nineties, the semiconductor market is characterised by a continuous volume exponential growth, a dramatic price drop and a strong acceleration of new technology innovations for manufacturing integration. Indeed, the scaling process forecasted at the start of the decade by the SIA Technology Roadmap has been strongly accelerated and a differentiation between microprocessors and memories occurred. The segmentation has been driven by the "commodity" nature of memories and by the related strong issue of production cost. As a part of the Memory Family, this factor has been impacting the introduction of innovative process steps also on Non Volatile products like FLASH. Moreover, the evolution of the fabrication technology for flash memories has also been driven by its unique demand in terms of cell reliability and more precisely, in terms of cell cycling and data retention, that has forced technology evolution to develop specific process steps. In the following, a review of the main peculiarities of flash process fabrication modules is presented.
机译:在九十年代结束时,半导体市场的特点是持续的体积指数增长,戏剧性的价格下降,并强烈加速制造集成的新技术创新。实际上,SIA技术路线图在十年开始时预测的缩放过程已经强烈加速,微处理器和记忆之间的差异发生。分割已经受到记忆的“商品”性质的推动,并通过相关强大的生产成本问题。作为记忆家庭的一部分,这一因素在闪存等非挥发性产品上也影响了创新过程步骤的引入。此外,对于闪存的制造技术的演化,在细胞可靠性方面,在细胞可靠性方面,在细胞循环和数据保留方面,这是一种强迫技术演变来开发特定工艺步骤的唯一需求。在下文中,提出了对闪光过程制造模块的主要特性的综述。

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