Development of 0.025 mm pitch anisotropic conductive film

摘要

Anisotropic conducting adhesive technology for flip chip interconnection, is being actively investigated now. We are now developing new structure of Anisotropic Conductive Film (ACF), which has been designed to be able to connect between a bump-less chip and a high density print circuit board. This paper describes the challenges encountered in the development of this new ACF.