Development of 0.025 mm Pitch Anisotropic Conductive Film

摘要

Anisotropic conducting adhesive technology for flip chip interconnection is being actively investigated in the current electronic industry. We are developing the novel Anisotropic Conductive Film(ACF) shown in Fig. 1, which can connect a bump-less chip and a high density printed wiring board (PWB). This ACF is composed of linear metal material "pillars" (not small conductive particles) and thermoplastic polymer resin. This flip-chip interconnection with the ACF between bump-less pads of a chip and Ni/Au plated pads(100μm pitch) on a FR-4 PWB shows good reliability in various environmental tests such as thermal cycling test (-50 °C/+125 °C 1000cycles), pressure cooker test (120C 2.1atm 100%RH 144h) and temperature humidity bias test (85 °C/85%/5.5V 1000h).