Introduction to electronic packaging: an undergraduate textbook

摘要

An undergraduate text book that introduces the subject of packaging in a cross-discipline and system-level fashion is proposed. It will be authored by some of the leading academic and industry experts from around the world. The proposed chapter topics include: (1) what is electronic packaging? (its importance and its markets); (2) technology drivers; (3) electrical design fundamentals; (4) thermo-mechanical design fundamentals; (5) packaging materials and processes; (6) single chip packages; (7) multi chip packages; (8) chip assembly; (9) printed wiring board (PWB); (10) chip-to-board connections; (11) discrete components; (12) optoelectronic packaging; (13) RF electronics; (14) sealing and encapsulation; (15) electrical testing; and (16) reliability.