Frequency Domain Based Measurement Method for the Thermal Parameters of a Thin-Film Diaphragm Embedded in a MEMS Multi-Parameter Wind Sensor

摘要

We report on a novel method to determine the thermal conductivity, thermal diffusivity, and average emissivity of a thin-film diaphragm embedded in a MEMS multi-parameter wind sensor. Compared to other measurement techniques for thermal thin-film parameters, our method does not require fabrication of custom specimens. The results can be obtained from frequency response measurements directly carried out on the wind sensor. We describe the theoretical background of this method, provide an efficient analytical model (validated by FEM simulations) for the parameter extraction from the raw measurement data, and demonstrate its application by sample measurements performed on multi-layer Si_xN_y-SiO2 thin-film diaphragms.