首页> 外文会议>International symposium on silicon materials science and technology >EVALUATION OF MICROSCOPIC LEAKAGE CURRENT INDUCED BY BULK MICRO DEFECTS
【24h】

EVALUATION OF MICROSCOPIC LEAKAGE CURRENT INDUCED BY BULK MICRO DEFECTS

机译:散装微缺损诱导的微观漏电流评价

获取原文

摘要

We have measured the p-n junction leakage current, for different groups of Si substrates. Kink current was found in the Czochralski Si wafer with near-surface micro defects. Compared with the kink current frequency and the micro-defect density measured by the TEM observation, it was clarified that the kink current is locally induced by these defects in the depletion layer. We will introduce a diagnostic method to detect the micro-defect density and discuss the detection limit of the method. Based on the above analysis, we will also discuss the IC failure mode caused by the grown-in defects and the Si crystal properties required for future LSIs.
机译:我们已经测量了P-N结漏电流,用于不同的Si基板。在Czochralski Si晶圆中发现了扭结电流,具有近表面微缺陷。与扭结电流频率和通过TEM观察测量的微缺陷密度相比,阐明了扭结层中的这些缺陷局部诱导的扭结电流。我们将介绍一种诊断方法来检测微缺陷密度并讨论该方法的检测限。基于上述分析,我们还将讨论由生长的缺陷和未来LSI所需的Si晶体特性引起的IC故障模式。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号