Contact temperature measurements on chip surface for reliability investigations of high power IGBT modules in traction applications

摘要

: This paper deals with contact temperature measurements on high power IGBT chips surface in power cycling conditions. A particular temperature measurement method by fast optical fibers with phosphor sensors is presented and compared with the classical thermocouples method, the IR imaging method and the indirect junction temperature measurement method by emitter-collector voltage. An example of temperature distribution obtained on a 1200A- 1600V IGBT module in cycling conditions is finally showed.