Dielectric, thermal and mechnaical properties of microelectronic packaging materials based on aln filled thermoplastics liquid crystal polymer

摘要

In this work, a series of composite materials of varying compositions based on a thermoplastic polymer and particulate aluminium nitride (AlN) were compounded and injection molded. In particular, detailed study was carried out to understand the effect of AlN on the dielectric constant, thermal conductivity and thermal expansion behaviour of these materials. Discussion is carried out on the flow induced anisotropic thermal mechanical and dielectric properties of the composites during processing. An increase by about 80percent in thermal conductivity of the composite materials is achieved as compared to the unfilled polymer. The dielectric constants of these composites were found to increase with filler content and range from 3.6 to 5.0 at 1kHz and 3.0 to 4.2 at 10 MHz. Substantial reduction in thermal expansion coefficient was also achieved in the composite materials. Also the anisotropy of the liquid crystalline polymer is substantially reduced by introduction of the AlN particles.