Molding Compound Development in the TRP Plastic Packaging Consortium

摘要

The Plastic Packaging Consortium (PPC), a Technology Reinvestment Project (TRP) funded by DARPA under SOL 94-27 addresses the needs to build up and strengthen an onshore infrastructure for ruggedized, thermally enhanced, and high density packages. There are 8 member companies and 2 government agencies participating: National Semiconductor, Delco Electronics, Leading Technologies, Olin Metals, Dexter Electronics, Plaskon/Amoco Chemicals, Integrated Packaging Assembly, Sheldahl, RelTech, and Sandia National Laboratories. The program is monitored by DARPA and NIST.