Initial investigations into low-cost ultra-fine pitch solder printing process based on innovative laser printing technology

摘要

Advances in electronics packaging and assembly technology are driving increased demand for ultra-fine pitch solder deposition. In this work, innovative solder deposition techniques based on laser printing are being investigated for low-costultra-fine pitch printing applications. This paper will investigate the feasibility of using solder particles in off the shelf xerographic technology. The physics of the two development Systems (dual component and monocomponent) will be discussed Thisinquisition will lead to a discussion of triboelectric charging of the solder toners, coating the solder with thin dielectrics, and charge induction by an applied electric field. The results from these investigations are used to assess feasibility anddefine future work.