Microsystems involve many different scientific disciplines and technical fields. Even though microsystem technology is based on IC technology, there are many important differences such as to the number of product manufactured per technology, cost and development time. These aspects have to be taken into account in the design of a microsystem development and manufacturing environment. The CSEM approach to that challenge is based on a wafer fab focusing on 3 technology families: i) bulk silicon micormechanics for capacitive pressure and acceleration sensors, ii) galvanic technology for coils for magnetic actuators and position sensors and iii) a quartz technology for UV-beam shaping applications. The associated packaging line is based on a flexible manufacturing concept to handle many product each produced in relatively low numbers. This industrialization concept is intended to respond to a fast growing market need for customized microsystem products.
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