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In-situ joined CMC components

机译:原位加入了CMC组件

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The Liquid Silicon Infiltration (LSI) process allows the joining of CMC parts during manufacturing, i.e. C/C-SiC joints can be produced in-situ. Porous C/C components are prepared and fixed together and molten silicon is caused to flow between the surfaces and react with the carbon material to convert it to silicon carbide and bond the surfaces together. Basic investigations have been carried out in terms of surface preparation, gap geometry, addition of paste, and its composition, and infiltration parameters. Lap joint specimens have been manufactured and tested with standardised geometry under compression. The mechanical and microscopical tests allowed the selection of an appropriate joining method which was transferred to real components. Thispaper deals with first results of this novel liquid phase bonding of CMC components.
机译:液态硅渗透(LSI)工艺允许在制造过程中加入CMC部件,即C / C-SiC接头可以原位生产。制备和固定在一起的多孔C / C组分,并使熔融硅在表面之间流动并与碳材料反应以将其转换为碳化硅并将表面粘合在一起。在表面制备,间隙几何形状,糊剂和其组成方面进行了基本研究,以及其组成以及渗透参数。通过压缩下的标准化几何制造和测试了LAP关节标本。机械和显微镜测试允许选择将其转移到真实组件的合适连接方法。此纸纸涉及该新型液相键合CMC组件的首先结果。

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