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Integrated Sublimator Driven Coldplate (ISDC) Test Results and Model Correlation

机译:集成升华器驱动的冷板(ISDC)测试结果和模型相关性

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The Integrated Sublimator Driven Coldplate (ISDC) is a novel thermal control device that combines the functions of a flow-through coldplate and a sublimator while maintaining integration with a pumped fluid loop. This is in contrast to a Sublimator Driven Coldplate (SDC) which is not integrated with the fluid loop. The advantage of the ISDC is the consolidation of conventional hardware that perform singular functions into one capable of operating in multiple modes simplifying overall architecture, increasing failure tolerance, and providing system mass savings. Since the concept can transport heat via a pumped loop or remove heat via sublimation, consumables are minimized. A short duration staged vehicle would see the greatest benefit of implementing an ISDC in an Active Thermal Control System (ATCS). An Engineering Development Unit (EDU) has been designed, manufactured, and tested in Paragon’s ECLSS Human-rating Facility (EHF) to verify anticipated operation in all modes and validate analytical models used to predict thermal performance. The ISDC EDU has top and bottom mounting surfaces totaling roughly 0.5 m2 and is nominally designed for heat rejection of 1550 W including 1250 W from avionics mounted directly to it. The design is intended to be easily scalable to other sizes and heat loads as architectural requirements dictate. This paper discusses the results of ISDC EDU testing and correlation of those results to analytical predictions. The validated analytical model can be used to aid in the design of ISDC solutions to any number of anticipated system architectures.
机译:集成的升华器驱动的冷板(ISDC)是一种新的热控制装置,它结合了流通冷板和升华器的功能,同时保持与泵送流体回路的集成。这与未与流体回路集成的升天器驱动的智能板(SDC)相反。 ISDC的优点是将常规硬件的整合整合,该硬件对能够以多种模式运行的单个功能,简化整体架构,增加故障容忍度和提供系统大量节省。由于该概念可以通过泵送环路或通过升华除去热量来运输热量,因此最小化耗材。短持续时间暂存的车辆将看到在有源热控制系统(ATC)中实现ISDC的最大益处。在Paragon的ECLS人类评级设施(EHF)中设计,制造和测试了工程开发单元(EDU),以验证所有模式的预期操作,并验证用于预测热性能的分析模型。 ISDC EDU具有顶部和底部安装表面,总计大约为0.5平方米,标称设计用于加热抑制1550W,包括直接安装在其上的AviOnics 1250 W.该设计旨在容易地可扩展到其他尺寸和热负荷,因为架构要求决定。本文讨论了ISDC EDU测试的结果和这些结果与分析预测结果的相关性。经过验证的分析模型可用于帮助ISDC解决方案设计到任何数量的预期系统架构。

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