Integrated circuits for an experimental 10 Gb/s (SONET OC-192) self-healing ring

摘要

SONET OC-192 with a data transmission rate of 9.95328 Gb/s has emerged as the next generation high capacity optical carrier. This paper presents the first complete implementation of 10 Gb/s multiplexing, demultiplexing and SONET framing functions on a 3-chip chip-set. The chip-set consists of an 8:1 multiplexer with auto phase alignment, a 1:8 demultiplexer with SONET frame detection and a multi-purpose interface chip to simplify system integration-all designed to operate at 10 Gb/s for use in an experimental SOMET OC-192 self-healing ring test bed. These experimental research prototype devices are based on the AlGaAs/GaAs Hetero-junction Bipolar Transistor (HBT) technology (f/sub t/=60 GHz). High speed packaging and system integration issues are also addressed.