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Bottom-side wave solder process compatibility for 14 and 16-pin gull wing SOICs

机译:底侧波焊接工艺兼容性14和16针鸥翼式SOIC

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Results are summarized on the process compatibility for bottom-side wave soldering of eleven different 14 and 16-pin plastic encapsulated Small Outline Integrated Circuits (SOICs) in a Gull Wing foot print (SOGs). Devices were preconditioned to a saturated moisture exposure of 85/spl deg/C/85%RH for 168 hours (to simulate a worst case storage environment equivalent to 30/spl deg/C/90%RH) before exposure to a total molten solder immersion at 260/spl deg/C. A low solids flux and a terpene hydrocarbon cleaning were applied for process chemical exposure. Damage analysis was assessed through the use of C-mode Scanning Acoustic Microscopy (C-SAM) followed by Temperature-Humidity-Bias (THB) life testing. The results of these test procedures showed that nine out of eleven device codes successfully passed the wave-solder process compatibility testing. Two codes did not pass all criteria established for the process compatability. One of these codes was found to fail because of internal cracking of the mold compound. Cracks were found to originate at the top of the die and propagated laterally towards the edge of the packages. A Finite Element Model was developed for predicting internal stresses that developed during the solder immersion process. Finite Element analysis indicated that the cracking behavior is associated with the development of high stresses at the die edge as a result of a large distributed water-vapor pressure built up in die surface delaminations. Based on the experimental results and the Finite Element Analysis, it is concluded that the observed moisture induced cracking is a function of both the size of the paddle as well as the die. For those devices included in this study it is considered that wave-solder process compatibility for non-dry bagged 14 and 16 pin SOGs can be assured provided a maximum allowable paddle-to-package size is maintained.
机译:结果总结了在鸥翼脚印(SOG)中的11个不同14和16针塑料封装的小型集成电路(SOICS)的底侧波焊接的过程兼容性。在暴露于总熔融焊料之前,将装置预处理为85 / SPL DEG / C / C / 85%RH的饱和水分暴露于85 / SPL DEG / C / 85%RH(以模拟相当于30 / SPL DEG / C / 90%RH)的最坏情况储存环境浸在260 / spl deg / c。施加低固体通量和萜烯烃清洁,用于工艺化学暴露。通过使用C模式扫描声学显微镜(C-SAM),然后进行耐温湿度 - 偏压(THB)寿命测试来评估损伤分析。这些测试程序的结果表明,11个设备代码中的九个成功通过了波焊过程兼容性测试。两个代码没有通过建立的过程兼容性的所有标准。由于模具化合物的内部裂缝,发现这些代码中的一种失败。发现裂缝起源于模具的顶部并横向地朝向包装的边缘传播。开发了有限元模型,用于预测焊料浸渍过程中开发的内部应力。有限元分析表明,由于在模具表面分层内置的大分布式水蒸气压力,裂化行为与模具边缘处的高应力的开发相关联。基于实验结果和有限元分析,得出结论,观察到的水分诱导的裂缝是桨叶的尺寸以及模具的函数。对于本研究包括的那些装置,认为可以确保保持对非干袋14和16销袜的波焊接工艺兼容性。提供最大允许的桨式到封装尺寸。

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