首页> 外国专利> LEAD FOR SOLDERING GULL-WING LEAD PACKAGE SURFACE MOUNT COMPONENT

LEAD FOR SOLDERING GULL-WING LEAD PACKAGE SURFACE MOUNT COMPONENT

机译:焊接鸥翼式铅包表面安装组件的铅

摘要

PURPOSE: To enable properly and surely soldering the lead for soldering a gull- wing lead package surface mount component, by performing bending work at the tip of the lead for soldering the gull-wing lead package surface mount component. ;CONSTITUTION: In the lead for soldering a gull-wing lead package surface mount component, base metal 2 is coated with fusible alloy 1, and bending work is performed at the tip of the base metal 2. Thereby, the rupture surface on which an oxide film of the tip end surface of the lead for soldering a conventional gull-wing lead package surface mount component is formed is not directly soldered, and soldering is performed on a bent corner part coated with the fusible alloy 1. Hence, solder wetability is improved, and solderability to the soldering lead of the gull-wing lead package surface mount component and the long term guarantee of soldering quality are enhanced.;COPYRIGHT: (C)1995,JPO
机译:目的:通过在用于焊接鸥翼式引线封装表面安装组件的引线尖端进行弯曲加工,以正确,可靠地焊接引线以焊接鸥形翼引线封装表面安装组件。 ;构成:在用于焊接鸥翼形引线封装表面安装组件的引线中,母材2涂有易熔合金1,并在母材2的尖端进行弯曲加工。不直接焊接形成用于焊接常规鸥翼式引线封装表面安装组件的引线的顶端表面的氧化膜,而是在涂覆有易熔合金1的弯角部分进行焊接。改进,提高了鸥翼式引线封装表面安装元件的可焊性,并提高了焊接质量的长期保证。;版权所有:(C)1995,日本特许厅

著录项

  • 公开/公告号JPH07221247A

    专利类型

  • 公开/公告日1995-08-18

    原文格式PDF

  • 申请/专利权人 SEIKO EPSON CORP;

    申请/专利号JP19940011839

  • 发明设计人 MIYAZAWA HIROYASU;

    申请日1994-02-03

  • 分类号H01L23/50;

  • 国家 JP

  • 入库时间 2022-08-22 04:24:37

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