A reliable die attach method for high power semiconductor lasers and optical amplifiers

摘要

We have developed a reliable, high yield, void-free method for soldering high power semiconductor laser diodes epitaxy-side down. We have consistently obtained absolute thermal resistances as low at 1.5/spl deg/C/Watt and specific thermal resistances of 4/spl middot/10/sup -3/ K/spl middot/cm/sup 2//Watt on oxygen-free high conductivity (OFHC) copper heatsinks. This method has very wide process margins (75/spl deg/C), exhibits excellent repeatability (4%), and is suitable for laser die attach to diamond submounts.