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An on-chip diagnosis methodology for embedded cores with replaceable modules

机译:具有可更换模块的嵌入式核心片上芯片诊断方法

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We propose a design for test and diagnosis architecture that simplifies the process of identifying failures within a failing sub-module, without explicitly identifying the faults responsible for that failure. The extra hardware eliminates the post-processing step needed to process the failure logs from the tester and automatically determines the sub-modules inside a core that must be replaced. The proposed methodology reduces the turnaround time for locating a failing module or sub-module and also facilitates testing and diagnosis at the same time. Experimental results are presented using industrial test-cases to validate the effectiveness of the proposed method.
机译:我们提出了一种测试和诊断架构的设计,可以简化识别失败的子模块中的故障的过程,而无需明确识别负责该故障的故障。额外的硬件消除了处理故障从测试仪处理失败日志所需的后处理步骤,并自动确定必须替换的核心内的子模块。所提出的方法可以减少用于定位故障模块或子模块的周转时间,并同时促进测试和诊断。使用工业测试案例介绍了实验结果,以验证提出的方法的有效性。

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