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Stability Analysis of SRAM Designed Using In0.53Ga0.47As nFinFET with Underlap Region

机译:使用IN0.53GA0.47AS NFINFET设计的SRAM稳定性分析

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In this paper, the static noise margin (SNM) performance of 6T-static random access memory (SRAM) cell has been demonstrated by utilizing sub-14 nm In0.53Ga0.47As nFinFET devices with underlap fin length (Lun) for low-voltage operation. The quantum corrected drift-diffusion model along with density gradient approach is used to perform the simulation for In0.53Ga0.47As nFinFET with 14 nm channel length. We have assessed the impact on the SRAM stability with the help of SPICE simulations using the BSIM-CMG model. Simulations have been carried out with different Lun values such as 0, 3, 6, 9 nm to extract SRAM stability parameters. The device with Lun= 9 nm has reported the Static Voltage Noise Margin (SVNM) and Write Trip Voltage (WTV) of 6T-SRAM with 281 mV and 251 mV, respectively using an N-curve technique.
机译:在本文中,6T-静态随机存取存储器(SRAM)单元的静态噪声容限(SNM)的性能已被证明通过利用子14纳米的 0.53 GA. 0.47 如nFinFET设备与欠重叠鳍片长度(L<子的xmlns:MML = “http://www.w3.org/1998/Math/MathML” 的xmlns:的xlink = “http://www.w3.org/1999/xlink”>未),用于低电压操作。用密度梯度方法沿着量子校正漂移扩散模型被用于为在执行所述仿真 0.53 GA. 0.47 如nFinFET与14nm的沟道长度。我们已评估与SPICE仿真使用BSIM-CMG模型的帮助下,SRAM稳定性的影响。仿真都在不同的L进行,<子的xmlns:MML = “http://www.w3.org/1998/Math/MathML” 的xmlns:的xlink = “http://www.w3.org/1999/xlink”>未 值,诸如0,3,6,9纳米至提取物SRAM稳定性参数。与L中的设备<子的xmlns:MML = “http://www.w3.org/1998/Math/MathML” 的xmlns:的xlink = “http://www.w3.org/1999/xlink”>未= 9nm的已报告的静态电压噪声余量(SVNM)中,用281毫伏和251毫伏,分别使用N曲线技术6T-SRAM的写入跳闸电压(WTV)。

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