New optical waveguide structure: a trench-channel-type high-density waveguide in Si

摘要

A new optical waveguide suitable for high-packing-density OEICs is proposed. The waveguides are embedded in trenches, with large depth/width ratios, in a silicon substrate. The spacing between the waveguides and their pitch were less than 2 $mu@m and 4 $mu@m, respectively. This structure enables ultra high density optical interconnections in a silicon substrate.