The experimental and computational results for the transient mixed convective opposing flow over discrete uniform heat flux components are presented. The present model simulates electronic modules mounted on vertical parallel boards. Each board includes adiabatic and heated flush segments with finite thermal capacity. The convection field is composed of an upward buoyancy induced flow generated by discrete heated components, and an opposed weak downflow resulting from an adverse pressure field. This circumstance may arise in electronic packaging and in regions where cooling is intended to rely on natural convection, however an adverse pressure field may occur due to forced convection cooling in other parts of the system. The computational scheme used in the solution is entitled "Simple Arbitrary Lagrangian Eulerian " (SALE) that is modified to include the energy balanced boundaries of the heated segments with consideration of the surface heat capacity. The full two-dimensional equations governing the flow and energy fields are solved. Temperatures at different surface locations and velocity distributions are evaluated by the experimental setup and are compared with the predicted results by SALE. Fair agreement is observed between the experimental and predicted results for the component temperature profiles. Some overshoot in temperature was observed in both experimental and numerical results. The investigation is extended to relate the Nusselt number for each source to the flow Reynolds number.
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