首页> 外文会议>International symposium on microelectronic package and PCB technology >PRECISION FINENESS OF GRIND (F.O.G.) MEASUREMENT INSTRUMENTATION AND TECHNIQUES FOR PASTES USED IN MICROELECTRONICS AND THE ELECTRONICS INDUSTRY IN GENERAL
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PRECISION FINENESS OF GRIND (F.O.G.) MEASUREMENT INSTRUMENTATION AND TECHNIQUES FOR PASTES USED IN MICROELECTRONICS AND THE ELECTRONICS INDUSTRY IN GENERAL

机译:Grind(F.O.G.)测量仪表和微电子和电子行业中使用的浆料的测量仪器和技术

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摘要

The commercially available Fineness of Grind Gauges are unacceptable for meaningful analyses required in many industries......especially electronics and microelectronics. The correlation chart method (used still by some firms) provides very limited benefits and is generally limited to in-house tests.A unique, precision long-lived "state-of-the art" FOG block has been developed and is now available. An improved wiper blade provides long term advantages. Superior accuracy and reproducibility has been achieved with a total, automatic integrated system.
机译:在许多行业所需的有意义的分析中,Grind仪的市售细度是不可接受的......特别是电子和微电子。相关图方法(仍然由某些公司使用)提供了非常有限的益处,并且通常仅限于内部测试.A独特,精密的长寿“最先进的”雾块已经开发并现在可用。改进的刮水片提供长期优点。通过总,自动集成系统实现了卓越的精度和再现性。

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