Model of the process of dissolution and swelling of thin polymethylmethacrylate films

摘要

In the fabrication of integrated circuits (IC) the solubility dependence of a polymer on its macromolecular length is used. The development process is multistage and involves series thicknesses just as in photo and plasma etching. In lithography this process is considered surface and its rate depends on average molecular mass. We expect that the dissolution rate is a time function and that it depends not only on M, but also on the mass-molecular distribution. We propose that the swelling factor is important too. The aim of this work is to construct a model of swelling and dissolution processes and to estimate the positive resists contrast dependence on the polymerization degree and solvent thermodynamic quality.