Microchannel heatsink with liquid-nitrogen cooling

摘要

Excellent thermal performance of a silicon microchannel heatsink is demonstrated using liquid nitrogen as the coolant over a wide range of heat loads up to 1 kW/cm$+2$/. This performance is partly due to the order of magnitude increase in the thermal conductivity of silicon near 77$DGR@K compared to room temperature. Subcooled boiling of the liquid nitrogen in the microchannel heatsink further enhances the thermal performance but makes the thermal resistance a nonlinear function of heat load. For a 500 W/cm$+2$/ heat load, a thermal resistance of 0.052 cm$+2*0$/C/W for a 9:1 aspect ratio heatsink was measured.